Handbook of Materials Failure Analysis (eBook)

Part 1: Electronics Industries1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry3. Failure of intermetallic solder ball due to stress shielding and amplification effects4. Assessment of the indoor corrosion in consumer electronics in subtropical climates.5. Pb-free Solder - Microstructural, Material Reliability and Failure Relationships6. The Role of Contamination in Failures of Electronics - Case Studies7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application9. New methodology for qualification and lifetime assessment of electronic systems Part 2: Textiles Industries10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique11. Failure of yarns in different textile applications12. Treatment effect on failure mode of industrial carbon textile at elevated temperature